Tag: Multi-chip module

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ISSCC: Roadmap on 3D Interconnect Density

Added to Collection on: 2021-03-01 16:07:30

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The evolving compute landscape: Preparing for an AI revolution

Added to Collection on: 2021-03-13 08:03:45

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What is InFO? Xilinx puts UltraScale+ Into InFO Packaging from TSMC

Added to Collection on: 2021-03-30 08:26:15

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OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem

Added to Collection on: 2021-04-06 18:00:00

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Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process

Added to Collection on: 2021-04-16 07:07:30

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Samsung Electronics Announces Availability of Its Next Generation 2.5D Integration Solution 'I ...

Added to Collection on: 2021-05-06 01:18:45

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CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers ...

Added to Collection on: 2024-02-20 04:15:05

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ECTC 2024 to highlight emerging technologies enabling heterogeneous integration and photonics

Added to Collection on: 2024-04-30 21:21:08

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Assistant professor in electrical and computer engineering revolutionizes chiplet designs ...

Added to Collection on: 2025-02-03 17:05:33

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Siemens Streamlines Design and Analysis of Complex, Heterogeneously Integrated 3D ICs

Added to Collection on: 2025-06-25 16:22:09

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