Tag: Backside power delivery

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Samsung unveils its AI chip technology road map - Taipei Times

Added to Collection on: 2024-06-13 23:10:45

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MOSFETs
Semiconductor device fabrication
Semiconductor devices
Backside power delivery
Samsung Electronics
TSMC
Samsung
Intel
Integrated circuit
Chartered Semiconductor Manufacturing
Fin field-effect transistor
Taiwan Semiconductor Manufacturing Co.
TrendForce Corp
Samsung Electronics Co.

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Broadcom still interested in taking over Intel's chip development | heise online

Added to Collection on: 2025-02-16 22:06:26

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Intel
Pat Gelsinger
TSMC
AMD
Panther Lake
Semiconductor device fabrication
Backside power delivery

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Nvidia and Broadcom are reportedly testing Intel's 18A process node - KitGuru

Added to Collection on: 2025-03-04 23:21:15

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Fabless semiconductor companies
Intel
Nvidia
Panther Lake
TSMC
Backside power delivery
Broadcom
Semiconductor device fabrication
2 nm process

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Report: TSMC could launch joint venture with partners to run Intel's fabs - SiliconANGLE

Added to Collection on: 2025-03-13 07:53:30

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TSMC
Semiconductor device fabrication
Fabless semiconductor companies
MOSFETs
Intel
Pat Gelsinger
Backside power delivery
STMicroelectronics
AMD
Taiwan Semiconductor Manufacturing Co.
Intel Corp.

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Taiwan's government strengthens 'silicon shield,' restricts exports of TSMC's most advanced ...

Added to Collection on: 2025-04-28 19:24:06

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Semiconductor device fabrication
TSMC
Backside power delivery
Application-specific integrated circuits
Semiconductor industry in Taiwan
2 nm process
United States

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Intel hedges its bet for High-NA EUV with the 14A process node - Tom's Hardware

Added to Collection on: 2025-05-02 16:31:02

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Extreme ultraviolet
Extreme ultraviolet lithography
Multiple patterning
Intel
Photomask
10 nm process
TSMC
Backside power delivery
Computational lithography
Euv
7 nm process
Draft:Twinscan

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Intel's new chip manufacturing technology is its greatest hope for a turnaround — and its biggest risk

Added to Collection on: 2025-05-17 10:44:05

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Fabless semiconductor companies
Intel
MOSFETs
TSMC
CHIPS and Science Act
Pat Gelsinger
Semiconductor device fabrication
Nvidia
Integrated circuit
AMD
Backside power delivery
2 nm process

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TSMC, World's Largest Contract Chipmaker & NVIDIA AI Supplier, Could Boost Output To ...

Added to Collection on: 2025-07-21 14:26:16

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Semiconductor device fabrication
MOSFETs
TSMC
Apple Silicon
Intel
Wafer
Semiconductor fabrication plant
GlobalFoundries
Backside power delivery
Taiwan

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TSMC: The Unseen Architect of the AI Revolution and Global Tech Dominance

Added to Collection on: 2025-10-04 18:54:01

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Application-specific integrated circuits
Semiconductor device fabrication
TSMC
China?United States relations
Backside power delivery
7 nm process
3 nm process
2 nm process
CHIPS and Science Act
5 nm process
Semiconductor industry
Intel
Taiwan Semiconductor Manufacturing Company

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The Foundry Frontier: A Trillion-Dollar Battleground for AI Supremacy

Added to Collection on: 2025-10-04 17:53:35

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Semiconductor device fabrication
Fabless semiconductor companies
China?United States relations
TSMC
Intel
CHIPS and Science Act
Backside power delivery
Semiconductor industry
3 nm process
2 nm process
AMD
Integrated circuit
Taiwan Semiconductor Manufacturing Company

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