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Weekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap

Retrieved on: 2025-05-26 02:18:41

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Weekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap. View article details on hiswai:

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... chip, likely manufactured using TSMC's 5nm process. ... Huang also reiterated that US export bans are accelerating Huawei's dominance in China's AI chip ...

Article found on: www.digitimes.com

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