TSMC to push silicon boundaries with 3D 'stacking' tech, dubbed as “SoIC”, partners with AMD and ...

Retrieved on: 2020-11-28 15:45:00

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MOSFETs

Electronics industry

Industries

Science and technology

Semiconductor device fabrication

Integrated circuits

TSMC

Three-dimensional integrated circuit

Apple-designed processors

Semiconductor industry

Moore's law

Intel

Taiwan Semiconductor Manufacturing Company Ltd.

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TSMC to push silicon boundaries with 3D 'stacking' tech, dubbed as “SoIC”, partners with AMD and .... View article details on hiswai:

Excerpt

NIKKEI Asia source reports that <b>TSMC</b> aims to work with Google, AMD and other U.S. tech giants to develop a new way of making semiconductors more ...

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