Synopsys Design Platform Enabled for TSMC's Multi-die 3D-IC Advanced Packaging Technologies

Retrieved on: 2018-10-03 04:03:45

Tags for this article:

Electronic engineering

Digital electronics

Technology

Integrated circuits

Electronic design automation

Semiconductor device fabrication

MOSFETs

Synopsys

Three-dimensional integrated circuit

Signoff

Integrated circuit design

Parasitic extraction

Synopsys Inc.

Click the tags to see associated articles and topics

Synopsys Design Platform Enabled for TSMC's Multi-die 3D-IC Advanced Packaging Technologies. View article details on hiswai:

Excerpt

<div>Synopsys Design Platform enabled for <b>TSMC's</b> WoW direct stacking and CoWoS technologies; Solution includes multi-die and interposer layout ...</div>

Article found on:

View Original Article