Broadcom teases 'cutting-edge' 3.5D XDSiP tech: 4 compute tiles, 12 HBM sites fabbed by TSMC

Retrieved on: 2024-12-09 02:09:45

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Broadcom teases 'cutting-edge' 3.5D XDSiP tech: 4 compute tiles, 12 HBM sites fabbed by TSMC. View article details on hiswai:

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Broadcom unveils its new 'cutting-edge' 3.5D XDSiP platform technology: enabling consumer AI customers to develop next-gen custom accelerators ...

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