Backend demand for HPC chips strong, but ABF substrate support matters

Retrieved on: 2021-06-28 08:30:17

Tags for this article:

Click the tags to see associated articles and topics

Backend demand for HPC chips strong, but ABF substrate support matters. View article details on hiswai:

Excerpt

ABF substrates are badly needed to support Intel's FC-LGA and EMIB operations, TSMC's CoWoS technology for packaging high-end AI chips or ...

Article found on: www.digitimes.com