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Retrieved on: 2018-02-05 23:56:15
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<div>Advanced Semiconductor Engineering Inc (ASE, 日月光半導體), the world's biggest chip tester and packager, yesterday said that it plans to invest US$70.5 million in a joint venture with <b>Qualcomm Inc</b> to develop and produce system-in-a-package (SiP) modules in Brazil. The modules would be used in ...</div>
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